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LAB Line Kurt J.Lesker磁控溅射LAB Line
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基本情况
武汉茂迪科技有限公司创立于2012年 ,多年来在实验室仪器业界创立了良好的专业技术和服务品牌,作为的综合性科学服务提供商,凭借自身强大的技术后盾、经济实力、客户基础、销售网络和品牌忠诚度,被数百家国内外科学仪器厂商为其产品在中国的一级代理。公司自创立以来,始终以成为客户的实验室管家为宗旨,秉承“诚信、专业、快速、创新”的服务理念,先后服务于包括政府专业实验室、大专院校、药检、商检、质检、工业企业研发、计量中心以及市政工程等广泛领域。
2012年,公司通过整合行业优质丰富的产品资源,*的物流配送系统,优化订货流程,快速审核,直接下单无需预付,旨在通过齐全的产品线和系统化服务为广大科研工作者提供整体解决方案,全面降低时间精力成本,提高工作效率,创造成就!
The Kurt J. Lesker Company® LAB Line UHV Sputter platform is purpose built for magnetron sputtering deposition applications. A chamber design tailored to fit UHV sputter process needs, an industry best software control system with advanced programming, load lock capability, and numerous features for optimized thin film performance are a few of the advantages offered in this innovative design.
The LAB Line series is compatible with the following techniques:
KJLC's innovative eKLipse™ software allows user-friendly recipe creation along with a graphical user interface that is intuitive for new PVD users whilst advanced for seasoned professionals. For more information on this intuitive, unique, and reliable software package, please see the Software Tab.
Optimized UHV Process Chamber
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Vacuum Pumping & Gauging
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SafetyFully enclosed system electronics rack.
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QualityUtilizing industry leading components allows KJLC to produce the highest quality PVD tools on the market. Components and key manufacturing points are:
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PumpingThe LAB Line offers two types of high vacuum pumping on its process chamber, a 1250L/s Pfeiffer turbomolecular pump or Brooks CTI-8F 1500 L/s, or cryo pump. The Pfeiffer turbomolecular pumps being a good choice for overall cost effective high quality pumping particularly for reactive sputtering applications. The Brook CTI cryo pumps find use in applications that require the lowest vacuum possible. |
DepositionThe LAB Line is Kurt J. Lesker's UHV magnetron sputtering platform. Only KJLC offers Mag-Keeper sputter sources with zero o-rings in the cathode body and a magnetically coupled target to allow for easy target changes. Our "patent pending" cooling well design enables operation at power densities up to 200 watts/.in2. This cathode is designed to sputter up to a 0.375" thick targets. Without a hold down clamp or dark space shield this cathode is capable of running as low as ≤ 1mTorr (material dependent). The unique dome shutter design eliminates the need for additional cross contamination shielding required with standard flip or swing shutters. Click to learn more about sputtering rates and uniformity. |
The LAB Line has been designed for optimal uniformities and allows. The chart to the left shows average expected uniformity by deposition type and substrate wafer diameter. Thickness measurements were made using a Profilometer or spectral reflectometer. The actual uniformity achievable will be a function of the final configuration of the system and process parameters. | Typical Deposition Uniformities |
TORUS® sources are operated at typical sputtering pressures (≤20 mTorr) and utilize Si wafers for deposition. SiO2 Target run with RF Power, film thickness >=500Å. Al Target run with DC Power, film thickness >=1500Å. Ni Target run with High Strength TORUS® & DC Power, film thickness >=1500Å.
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