产品简介
5G Sub 6 module, M.2 3052 Key B form factor, USB interface
详细介绍
Main Chipset MediaTek T700 Max UL peak rate of 1150Mbps Max DL peak rate 2.97 Gbps NSA EN-DC UL Max support 2 MIMO, DL Max support 4 MIMO M.2 3052 form factor, USB/ PCIe two sku interface Operating temperature: Normal operating temperature: -30 ~ 70 °C (-22 ~ 158 °F) AIW-357 DK-G1P: 5G (Sub-6G)/LTE module, PCIe communication interface, with GNSS, for NA/EU/JP/TW AIW-357 DK-G2U: 5G (Sub-6G)/LTE module, USB communication interface, with GNSS, for NA/EU/JP/TW
