产品简介
5G Sub 6 module, M.2 3052 Key B form factor, USB interface
详细介绍
Main Chipset Qualcomm SDX62 Max UL peak rate of 900Mbps Max DL peak rate 3.2 Gbps NR Sub6 EN-DC UL Max support 2 MIMO, DL Max support 4 MIMO M.2 3052 form factor, USB interface Operating temperature: Normal operating temperature: -30 ~ 75 °C (-22 ~ 167 °F) AIW-356 DQ-JK1: 5G(Sub-6G)/LTE/WCDMA module, with GNSS, for Japan/South Korea
