品牌
其他厂商性质
上海所在地
MALCOM PCU-285锡膏粘度计
面议
RHESCA 5200TN可焊性测试仪
面议
MALCOM PCU-02V微量螺旋式粘度计
面议
MALCOM PC-11AA/PC-11A/PC-11B/PC-11C螺旋式粘度计
面议
MALCOM SWB-2可焊性测试仪/润湿平衡测试仪/沾锡天平
面议
DIC RD-500SVBGA返修台
面议
MALCOM PCU-203锡膏粘度计
面议
MALCOM PCU-201锡膏粘度计
面议
MITO DENKO MID25-330T选择性波峰焊点焊机
面议
TAMURA TLF-204-NH(20-36)无铅无卤锡膏
面议
TAMURA EC-19S-8助焊剂
面议
BLUE M 146 SeriesClean Room Mechanical Convection Ovens
面议双轴晶圆切割机8020系列概要 |
The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation.
双轴晶圆切割机8020系列特点： |
Flexibility - Supports Hub and Hubless blades up to 3" O.D. |
Spindles of 1.8 kW or 2.4 kW high power (for challenging applications) |
Superior vision system with continuous zoom magnification |
Intuitive operation interface using a large 19” touch screen monitor |
